EN
|
Recruit
EN
|
Recruit
ABOUT
About MAP Engineering
CEO Message
Leaders
History
CI
Contact
SERVICES
High-Tech
Engineering Services
BIM & Digital Twin
PROJECTS
All
Featured
INSIGHTS
All
Research
BIM
PR
MAP News
MAP Culture
Facebook
Instagram
Youtube
Brochure
FAMILY
MAP GROUP
MAP A&E
MAP CM
KPEC
MAP-WORLDWIDE
ABOUT
About MAP Engineering
CEO Message
Leaders
History
CI
Contact
SERVICES
High-Tech
Engineering Services
BIM & Digital Twin
PROJECTS
All
Featured
INSIGHTS
All
Research
BIM
PR
MAP News
MAP Culture
Facebook
Instagram
Youtube
Brochure
FAMILY
MAP GROUP
MAP A&E
MAP CM
KPEC
MAP-WORLDWIDE
RECRUIT
삼성전자 베트남 TSP 신규거점 조성공사
SAMSUNG Electronics TSP New Base Construction, Vietnam
Contact PM
Client
Location
Program
Site Area
Gross Floor Area
Floors
Structure
SAMSUNG Electronics
Vietnam
산업시설
100,000.00 ㎡
86,825.24 ㎡
B1, 3F
RC, SC
← 목록으로 돌아가기